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EXEMPLARY PERFORMANCE AND EFFICIENCY FOR YOUR COMPUTE-INTENSIVE AND CLOUD-SCALE WORKLOADS

Powered by Intel® Xeon® 6/6+ Platform

The Intel Xeon 6 series processors are a robust lineup of CPUs designed to meet the diverse demands of modern data center workloads. From agentic AI and scientific compute to telco and web services, the Xeon 6 family delivers purpose-built processors optimized for a wide range of performance, efficiency, and deployment requirements. With the launch of Intel Xeon 6+ processors, the Xeon 6 series is further extended to deliver exceptional performance through higher core density, improved performance per watt, and enhanced memory capabilities, enabling more efficient and scalable deployment across cloud and telco infrastructures.

What are Intel® Xeon® 6 Processors?

Intel® Xeon® 6 CPUs are designed to meet diverse performance and efficiency requirements. Based on the new socket BR (LGA 7529) and E2 (LGA 4710), Intel introduced two new categories of CPUs: Intel® Xeon® 6 with E-cores to enable data center consolidation; reducing space and power consumption, and the Intel Xeon 6 with P-cores to deliver high performance for multiple computing-intense applications.

Efficient-cores (E-cores) deliver high core density and exceptional performance per watt, offering advantages for cloud-scale workloads that demand high throughput.

Performance-cores (P-cores) excel at a wide range of workloads and provide outstanding AI performance.

All Intel® Xeon® 6 CPUs have a compatible architecture with a shared software stack, so you can find solutions to match any business need.

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Intel-Xeon-6-Processors-LOGO

What are Intel® Xeon® 6+ Processors?

Intel® Xeon® 6+ CPUs are purpose-built for hyperscale data center, cloud-native workloads, and 5G telco infrastructure. Manufactured on the advanced Intel 18A process, the Xeon 6+ processor features more compute tiles than previous generations to boost both performance and efficiency.

  • Maximum Core Density: Scales up to 288 Efficient-cores (E-cores) per socket, providing immense throughput and high performance-per-watt for highly parallel cloud operations.
  • Advanced Security & Telemetry: Features built-in cryptographic acceleration alongside Intel® Trust Domain Extensions (Intel® TDX) and Application Energy Telemetry (AET) to protect and monitor dense cloud environments.
  • Consistent Architecture: Shares a unified software stack and platform compatibility with the broader Xeon® 6 family, ensuring seamless scalability without code modification.
Intel® Xeon® 6

Comprehensive Platforms for Intel® Xeon® 6

ASRock Rack offers a broad portfolio of systems supporting the full Intel® Xeon® 6 and Intel® Xeon® 6+ processor lineup. From power-efficient single-socket servers to high-performance dual-socket platforms, these solutions are designed to meet the diverse demands of modern data centers. Whether deployed for agentic AI, HPC, cloud-native infrastructure, or other wide-ranging demands, ASRock Rack servers deliver the flexibility to balance performance, scalability, and power efficiency.

Meet the Latest ASRock Rack Servers Supporting Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series Processors

GNR2D32TM3

GNR2D32TM3

  • Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC), supports DDR5 RDIMM, MRDIMM
  • 2 Gen-Z 4C (PCIe5.0 / CXL2.0 x16)
  • 12 MCIO (PCIe5.0 x8)
  • 3 MiniSAS HD (4 SATA 6Gb/s) by 3 ASM1164
  • Supports 2 M.2 (PCIe5.0 x4)
  • Up to 14 SATA 6Gb/s
  • 2 OCP NIC 3.0 (PCIe5.0 x16)
  • 2 RJ45 (1GbE) by Intel® i350
  • Remote management (IPMI)
GNRD8UD2-2T

GNRD8UD2-2T

  • Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 8 DIMM slots (1DPC); supports DDR5 RDIMM, MRDIMM
  • 2 PCIe5.0 / CXL2.0 x16
  • Up to 6 MCIO (PCIe5.0 / CXL2.0 x8)
  • 1 MiniSAS HD (4 SATA 6Gb/s) by ASM1061
  • Supports 2 M.2 (PCIe5.0 x4)
  • 2 RJ45 (10GbE) by Intel® E610-XAT2
  • Remote management (IPMI)
GNRD8HM3

GNRD8HM3

  • Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 8 DIMM slots (1DPC); supports DDR5 RDIMM, MRDIMM
  • 2 Slim Cool Edge (PCIe5.0 / CXL2.0 x16)
  • 2 MCIO (PCIe5.0 / CXL2.0 x8), 2 MCIO (PCie5.0 x8), 1 MCIO (PCIe5.0 x4)
  • 1 OCulink (4 SATA 6Gb/s)
  • Supports 2 M.2 (PCIe5.0 x4)
  • 4 SATA 6Gb/s
  • 1 OCP NIC 3.0 (PCIe5.0 / CXL2.0 x16)
  • Remote management (IPMI)
GNRD16DNO

GNRD16DNO

  • M-DNO Type2 (210mm x 305.59mm; 8.27" x 12")
  • Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16 DIMM slots (2DPC), supports DDR5 RDIMM
  • 8 MCIO (PCIe5.0 / CXL2.0 x8)
  • Supports 1 M.2 (PCIe5.0 x4), 1 M.2 (PCIe5.0 x2)
  • 1 OCP NIC 3.0 (PCIe5.0 / CXL2.0 x16)
  • 1 DC-SCM 2.0 module
  • Remote management (IPMI)
GNR2D16-2T

GNR2D16-2T

  • EEB (12" x 13")
  • Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 8+8 DIMM slots (1DPC), supports DDR5 RDIMM
  • 5 PCIe5.0 / CXL2.0 x16
  • 1 PCIe5.0 / CXL2.0 x8
  • 1 MCIO (PCIe5.0 / CXL2.0 x8)
  • Supports 2 M.2 (PCIe5.0 x2)
  • Up to 8 SATA 6Gb/s
  • 2 RJ45 (10GbE) by Intel® X710-AT2
  • Remote management (IPMI)
1U1G4E1S-GNR

1U1G4E1S-GNR

  • Single Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 8 DIMM slots (1DPC), supports DDR5 RDIMM, MRDIMM
  • 4 Hot-swap E1.S (PCIe5.0 x4) drive bays
  • 1 FHFL dual-slot PCIe5.0 x16, supports GPU and accelerator cards of up to 600W TDP each (25°C ambient temp.)
  • 1 HHHL single-slot PCIe5.0 x16
  • Supports 2 M.2 (PCIe5.0 x4)
  • 1 OCP NIC 3.0 (PCIe5.0 x16)
  • Remote management (IPMI)
2U12L4E-2S-GNR2

2U12L4E-2S-GNR2

  • Dual Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC), supports DDR5 RDIMM, MRDIMM
  • 4 hot-swap 3.5"/2.5" NVMe (PCIe5.0 x4)/SATA drive bays
  • 8 hot-swap 3.5"/2.5" and 2 hot-swap 2.5" SATA drive bays
  • 4 FHHL PCIe5.0 x16
  • Supports 2 M.2 (PCIe5.0 x4)
  • 2 OCP NIC 3.0 (PCIe5.0 x16)
  • Remote Management (IPMI)
2OU3N3G-GNR

2OU3N3G-GNR

  • Single Socket E2 (LGA 4710) per sled, supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 8 DIMM slots (1DPC) per sled, supports DDR5 RDIMM, MRDIMM
  • 4 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays per sled
  • 1 FHFL dual-slot PCIe5.0 x16 per sled, supports add-in cards up to 600W TPD at 25°C ambient
  • 1 HHHL single-slot PCIe5.0 x16 per sled
  • Supports 2 M.2 (PCIe5.0 x4) per sled
  • 1 OCP NIC 3.0 (PCIe5.0 x16) per sled
  • Remote management (IPMI) per sled
2U16X-GNR2/DLC RUBIN

2U16X-GNR2/DLC RUBIN

  • Fully liquid-cooled 2U rackmount with IT Gear Connector for 54V DC busbar
  • NVIDIA HGX™ Rubin NVL8
  • Dual Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC); supports DDR5 RDIMM, MRDIMM
  • 8 Hot-swap liquid-cooled E1.S NVMe (PCIe6.0 x4) drive bays
  • 1 FHHL PCIe6.0 x16 for liquid-cooled NVIDIA BlueField-4 DPU
  • Supports 2 M.2 (PCIe5.0 x4)
  • 8 OSFP (800Gb/s) via NVIDIA ConnectX®-9 SuperNIC™
  • 1 RJ45 (1GbE) by Intel® I210
  • Remote management (IPMI)
4UXGM-GNR2 CX8

4UXGM-GNR2 CX8

  • 4U NVIDIA MGX™ with 3+1, 80-PLUS Titanium, 3200W CRPS
  • Dual Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC); supports DDR5 RDIMM, MRDIMM
  • 16 Hot-swap E1.S (PCIe5.0 x4) drive bays
  • 8 FHFL dual-slot PCIe5.0 x16
  • 1 FHHL PCIe5.0 x16
  • Supports 1 M.2 (PCIe5.0 x4), 1 M.2 (PCIe5.0 x2)
  • 8 QSFP112 (400Gb/s) ports via NVIDIA ConnectX®-8
  • 2 RJ45 (1GbE) by Intel® i350
  • Remote Management (IPMI)
4U10G-GNR2/RF+

4U10G-GNR2/RF+

  • 4U Rackmount with 3+1, 80-PLUS Titanium, 3200W CRPS
  • Dual Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC); supports DDR5 RDIMM, MRDIMM
  • 18 hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays
  • Up to 16 hot-swap 2.5" SATA/SAS drive bays Additional RAID/HBA card required
  • 10 FHFL dual-slot PCIe5.0 x16 (with PEX89104 PCIe Switch)
  • 1 FHFL single-slot PCIe5.0 x16 (CPU direct link), 2 FHHL PCIe5.0 x16
  • Supports 1 M.2 (PCIe5.0 x4)
  • 1 OCP NIC 3.0 (PCIe5.0 x16), 2 RJ45 (1GbE) by Intel® i350
  • Remote Management (IPMI)
4U16X-GNR2/DLC B300

4U16X-GNR2/DLC B300

  • 4U Rackmount with 5+5, 80-PLUS Titanium, 3000W CRPS
  • Direct-to-chip single-phase liquid cooling
  • NVIDIA HGX™ B300 8-GPU
  • Dual Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC); supports DDR5 RDIMM, MRDIMM
  • 2 FHHL PCIe5.0 x16
  • 10 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays from PCIe Switch
  • 2 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays from CPU
  • Supports 1 M.2 (PCIe5.0 x2)
  • 8 OSFP (800Gb/s) via NVIDIA ConnectX®-8 SuperNIC™
  • 2 RJ45 (1GbE) by Intel® i350-AM2
  • Remote management (IPMI)
8U16X-GNR2 B300

8U16X-GNR2 B300

  • 930 x 448 x 353.6mm (36.6 x 17.6 x 13.9)
  • 8U Rackmount with 6+6, 80-PLUS Titanium, 3000W CRPS
  • NVIDIA HGX™ B300 NVL8 with NVIDIA NVLink™
  • Dual Socket E2 (LGA 4710), supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
  • 16+16 DIMM slots (2DPC); supports DDR5 RDIMM, RDIMM-3DS, MRDIMM
  • 4 FHHL PCIe5.0 x16
  • 12 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays
  • Supports 1 M.2 (PCIe5.0 x2), 2 M.2 (PCIe5.0 x4)
  • 8 OSFP (800Gb/s) via NVIDIA ConnectX-8 SuperNIC
  • 2 RJ45 (1GbE) by Intel® i350-AM2
  • Remote management (IPMI)

Meet the Latest ASRock Rack Servers Supporting Intel® Xeon® 6900P-series Processors

GNRAPD12DNO

GNRAPD12DNO

  • M-DNO Type2 (210 x 305.59mm)
  • Supports Intel® Xeon® 6900P-series processors
  • 12 DIMM slots (1DPC), supports DDR5 RDIMM, RDIMM-3DS, MCR DIMM
  • 8 MCIO (PCIe5.0 / CXL2.0 x8)
  • Supports 2 M.2 (PCIe5.0 x4)
  • 1 OCP NIC 3.0 (PCIe5.0 / CXL2.0 x16)
  • 1 DC-SCM 2.0 module
  • Remote management (IPMI)
1U8E1S-GNRAPDNO

1U8E1S-GNRAPDNO

  • 1U Rackmount with 1+1, 80-PLUS Platinum, 1600W RPSU
  • Single Socket BR (LGA 7529), supports Intel® Xeon® 6900P-series processors
  • 12 DIMM slots (1DPC), supports DDR5 RDIMM, RDIMM-3DS, MCR DIMM
  • 8 Hot-swap E1.S (PCIe5.0 x4) drive bays
  • 1 FHHL PCIe5.0 x16, 1 HHHL PCIe5.0 x16
  • 1 OCP NIC 3.0 (PCIe5.0 x16)
  • Supports 2 M.2 (PCIe5.0 x4)
  • 1 DC-SCM 2.0 module
  • Remote management (IPMI)

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