ASRock Rack Joins Open Compute Project U.S. Summit 2016

SAN JOSE, California, March 9, 2016
ASRock Rack is showcasing its OCP3-1L and OCP3-6S in Open Compute Project (OCP) U.S. Summit. The event is the annual gathering for industry's top leaders to discuss the new developments of OCP technology - an open design for datacenter products initiated by Facebook. As OCP solutions continue to make a presence in large datacenters, ASRock Rack is equipped to meet the customers' demands. ASRock Rack was founded in 2013 by leading mother vendor ASROCK. We focus on cloud-based datacenter and High Performance Computing (HPC).

ASRock Rack has collaborated with Lite-On Power System Solution to exhibit a 19" open rack system including 9 torpedoes from OCP3 series with customized supporting shelves. OCP3 series is ASRock Rack's OCP solution. It supports dual Intel^® Xeon E5 2600 v3 and memory slots up to 1024GB, capable of handling massive computing tasks. For large-scale datacenters, the effective power consumption is key. ASRock Rack's OCP products achieve up to 9% lower consumption than existing providers, which results in an eco-friendly and cost-effective solution. ASRock Rack also provides PIN headers for VGA/IPMO for customers' various applications. It fits their requirements for design for services (DFS) and design for manufacturing (DMS).

Visit our booth #E9 at OCP U.S. Summit 2016, which is been held in San Jose convention center. We look forward to seeing you there!

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